Sikafloor®-161 HC
2-PART EPOXY PRIMER, LEVELLING MORTAR, INTERMEDIATE LAYER AND MORTAR SCREED
Sikafloor®-161 HC is an economic, two part, solvent free, low viscosity epoxy resin.
- Low viscosity
- Good penetration
- Excellent bond strength
- Solvent free
- Easy application
- Short waiting times
- Multi-purpose
Usage
- For priming concrete substrate, cement screeds and epoxy mortars
- For low to medium absorbent substrates
- Primer for the Sikafloor®-263 SL HC and Sikafloor®-264 HC economic flooring systems
- Binder for levelling mortars and mortar screeds
- Intermediate layer underneath Sikafloor®-263 SL HC and Sikafloor®-264 HC
Advantages
- Low viscosity
- Good penetration
- Excellent bond strength
- Solvent free
- Easy application
- Short waiting times
- Multi-purpose
Packaging
15kg/set (Part A+B)
Colour
Part A – Resin : | Liquid, brownish-transparent |
Part B – Hardener : | Liquid, transparent |
Product Details
Composition
Epoxy
Shelf life
24 months from date of production if stored properly in original, unopened and undamaged sealed packaging
Storage conditions
Store in dry conditions at temperatures between +18 °C and +30 °C.
Density
Part A : | ~1.6 kg/L |
Part B : | ~1.0 kg/L |
Mixed Resin : | ~1.4 kg/L |
Solid content
~100 % (by volume) / ~100 % (by weight)
Shore D Hardness
7 days (at +23 °C) | ~76 |
Compressive Strength
28 days (at +23 °C) | ~60 N/mm2 (resin) |
Tensile Strength in Flexure
28 days (at +23 °C) | ~30 N/mm2 (resin) |
Tensile Adhesion Strength
> 1.5 N/mm² (failure in concrete) | (ISO 4624) |
Chemical Resistance
Resistant to many chemicals. Please ask for a detailed chemical resistance table.
Temperature Resistance
Exposure* | Dry Heat |
Permanent | +50 °C |
Short-term max. 7 d | +80 °C |
Short-term max. 12 h | +100 °C |
Short-term moist/wet heat* up to +80°C where exposure is only occasional (steam cleaning etc.).
*No simultaneous chemical and mechanical exposure and only in combination with Sikafloor® systems as a broadcast system with approx. 3 - 4 mm thickness.
Application
Mixing Ratio
Part A : part B = 79 : 21 (by weight)
Layer Thickness
As Top Coat : | 70 microns min. / 140 microns max. |
As stand alone coating : | 140 microns min. / 275 microns max |
Ambient Air Temperature
+10 °C min / +30 °C
Relative Air Humidity
80 % r.h. max.
Dew Point
Beware of condensation!
The substrate and uncured floor must be at least 3 °C above dew point to reduce the risk of condensation or blooming on the floor finish.
Note: Low temperatures and high humidity conditions increase the probability of blooming.
Substrate Temperature
+10 °C min / +30 °C
Substrate Moisture Content
< 4 % pbw moisture content.
Test method: Sika®-Tramex meter, CM-measurement or Oven-dry-method.
No rising moisture according to ASTM (Polyethylene-sheet).
Pot Life
Temperature | Time |
+10 °C | ~50 min |
+20 °C | ~25 min |
+30 °C | ~15 min |
Curing Time
Before applying solvent free products on Sikafloor®-161 HC allow:
Substrate Temperature | Minimum | Maximum |
+10 °C | 24 h | 4 d |
+20 °C | 12 h | 2 d |
+30 °C | 8 h | 24 h |
Before applying solvent containing products on Sikafloor®-161 HC allow:
Substrate Temperature | Minimum | Maximum |
+10 °C | 36 h | 6 d |
+20 °C | 24 h | 4 d |
+30 °C | 16 h | 2 d |
Times are approximate and will be affected by changing ambient conditions particularly temperature and relative humidity.
Applied Product Ready for Use
Substrate Temperature | Foot Traffic | Light Traffic | Full Cure |
+10 °C | ~24 h | ~6 d | ~10 d |
+20 °C | ~12 h | ~4 d | ~7 d |
+30 °C | ~8 h | ~2 d | ~5 d |
Note: Times are approximate and will be affected by changing ambient and substrate conditions.
Consumption
Coating System | Product | Consumption |
Priming | Sikafloor®-161 HC | 0.35 - 0.55 kg/m2 |
Levelling mortar fine (surface roughness < 1 mm) | 1 pbw Sikafloor®-161 HC + 0.5 pbw quartz sand (0.1 - 0.3 mm) + 0.015 pbw Extender T | 1.7 kg/m2/mm |
Levelling mortar medium (surface roughness up to 2 mm) | 1 pbw Sikafloor®-161 HC + 1 pbw quartz sand (0.1 - 0.3 mm) + 0.015 pbw Extender T | 1.9 kg/m2/mm |
Intermediate layer (self-smoothing 1.5 to 3 mm) | 1 pbw Sikafloor®-161 HC + 1 pbw quartz sand (0.1 - 0.3 mm) + optional broadcast quartz sand 0.4 – 0.7 mm | 1.9 kg/m2 mixture (0.9 kg/m2 binder + 0.9 kg/m2 quartz sand) per mm layer thickness ~ 4.0 kg/m2 |
Bonding bridge | Sikafloor®-161 HC | 0.3 - 0.5 kg/m2 |
Epoxy screed (15 - 20 mm layer thickness ) / Repair Mortar | 1 pbw Sikafloor®-161 HC + 8 pbw quartz sand | 2.2 kg/m2/mm |
Note: These figures are theoretical and do not allow for any additional material required due to surface porosity, surface profile, variations in level or wastage etc.
MIXING
Prior to mixing, stir part A mechanically. When all of part B has been added to part A, mix continuously for 3 minutes until a uniform mix has been achieved. When parts A and B have been mixed, add the quartz sand and if required the Extender T and mix for a further 2 minutes until a uniform mix has been achieved. To ensure thorough mixing pour materials into another container and mix again to achieve a consistent mix. Over mixing must be avoided to minimise air entrainment.
MIXING TOOLS
Sikafloor®-161 HC must be thoroughly mixed using a low speed electric stirrer (300 - 400 rpm) or other suitable equipment. For the preparation of mortars use a forced action mixer of rotating pan, paddle or trough type. Free fall mixers should not be used.
APPLICATION
Prior to application, confirm substrate moisture con- tent, r.h. and dew point.
If > 4% pbw moisture content, Sikafloor® EpoCem® may be applied as a T.M.B. (temporary moisture barrier) system.
Primer:
Make sure that a continuous, pore free coat covers the substrate. If necessary, apply two priming coats. Apply Sikafloor®-161 HC by brush, roller or squeegee.
Levelling mortar
Rough surfaces need to be levelled first. Apply the levelling mortar by squeegee/trowel to the required thickness.
Intermediate layer
Sikafloor®-161 HC is poured, spread evenly by means of a serrated trowel. Roll immediately in two directions with spiked roller to ensure even thickness and if required broadcast with quartz sand, after about 15 minutes (at +20 °C) but before 30 minutes (at +20 °C), at first lightly and then to excess.
Bonding bridge:
Apply Sikafloor®-161 HC by brush, roller or squeegee. Preferred application is by using a squeegee and then backrolling crosswise.
Epoxy screed / repair mortar:
Apply the mortar screed evenly on the still “tacky” bonding bridge, using leveling battens and screed rails as necessary. After a short waiting time compact and smoothen the mortar with a trowel or Teflon coated power float (usually 20 – 90 rpm).
CLEANING OF EQUIPMENT
Clean all tools and application equipment with Thinner C immediately after use. Hardened / cured material can only be mechanically removed.